Wafer Dicing Process Engineer

About the job

The Company: Our client is an iconic Industrial brand, with long standing history and significant ambitions to scale their presence in Vietnam.

Role & Responsibilities:

• Develop, optimize, and manage wafer dicing processes to ensure high-quality output and efficiency.
• Conduct experiments and analyze data to improve existing dicing techniques and equipment.
• Collaborate with cross-functional teams to troubleshoot and resolve process-related issues.
• Implement and oversee process changes and upgrades, ensuring compliance with industry standards and regulations.
• Monitor and maintain process documentation, including process flow charts, standard operating procedures (SOPs), and other technical documents.
• Provide technical support and training to production staff on dicing processes and equipment.
• Stay abreast of industry trends and advancements to continuously enhance process performance.

Qualifications:

• Educational background: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field. Advanced degree preferred.
• Experience: 2-5 years of experience in wafer dicing processes and related semiconductor manufacturing technologies.
• Strong understanding of dicing equipment, process optimization, and quality control methods.
• Proficiency in data analysis, problem-solving, and technical documentation.
• Excellent communication and teamwork skills, with the ability to work effectively in a fast-paced environment.
• Knowledge of industry standards and regulations relevant to semiconductor manufacturing.

To apply, please send your updated CV to Harvey at thong.luu@cgptalent.com, quoting the job title or Click Apply Now.
Due to an anticipated high volume of applicants, we regret that only shortlisted candidates will be notified.